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24 April 2020

Effect of voids on thermomechanical cracking in lead-free Sn3Ag0.5Cu interconnections of power modules

In this article, the effect of voids on thermomechanically-induced failure in the lead-free solder interconnections of power amplifier (PA) modules is investigated. […]

5 December 2019

Focal Length of a Low Permittivity Plano-Convex Lens at Frequencies 30-600 GHz

Due to interest in lenses at telecommunicatons in the lower frequency range of 30—600 GHz (5G/6G applications) sub-terahertz range lenses have started […]

31 May 2019

Power Module Interconnection Reliability in BTS Applications

In this paper, the reliability of RF power transistors’ solder attachments is characterized through experiments and simulations. Test cases consisted of power […]

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