Effect of voids on thermomechanical cracking in lead-free Sn3Ag0.5Cu interconnections of power modules
In this article, the effect of voids on thermomechanically-induced failure in the lead-free solder interconnections of power amplifier (PA) modules is investigated. […]
Focal Length of a Low Permittivity Plano-Convex Lens at Frequencies 30-600 GHz
Due to interest in lenses at telecommunicatons in the lower frequency range of 30—600 GHz (5G/6G applications) sub-terahertz range lenses have started […]
Power Module Interconnection Reliability in BTS Applications
In this paper, the reliability of RF power transistors’ solder attachments is characterized through experiments and simulations. Test cases consisted of power […]