A 32 x 128 SPAD-257 TDC Receiver IC for Pulsed TOF Solid-State 3-D Imaging
A single-chip receiver for pulsed laser direct time-of-flight 3-D imaging applications has been realized in a 0.35-μm HV CMOS technology. The chip […]
A single-chip receiver for pulsed laser direct time-of-flight 3-D imaging applications has been realized in a 0.35-μm HV CMOS technology. The chip […]